TICP provides diversified packages which are divided into two groups.



One is leadframe-based package, such as quad flat package (QFP), small outline package (SOP),thin small outline package (TSOP) , quad flat no lead (QFN) and dual flat no lead (DFN).



The other is substrate-based package, such as LGA,VLGA, Micro SD card and SD card.



Use the left items to find out more about our packages.