TICP was founded in 1998 located in KEPZ. Our factory is established by professional IC package and testing facilities to providing comprehensive semiconductor package (???) and testing services.

TICP leads the industry on developing Optical and Ultrathin IC package technologies. We are ISO14001 and TS16949 certified as well as Sony green partner.

Innovation, developing and consistency are our business objectives. Focusing on optical and micro packing technologies make TICP unique and being future star in the semiconductor market.